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High TG170 Impedance Control Pcb , Plain Pcb Board 4 Layers Anticorrosive

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High TG170 Impedance Control Pcb , Plain Pcb Board 4 Layers Anticorrosive

Name: High TG170 Impedance Control Pcb Plain Pcb Board 4 Layers Anticorrosive
Brand: LEFANG
Price: 1 USD

Buy cheap High TG170 Impedance Control Pcb , Plain Pcb Board 4 Layers Anticorrosive product

Brand Name : LEFANG

Model Number : RM0004L073

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1 Piece

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 290, 000 sqm Per Month

Delivery Time : 2-10 work days

Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing

Base Material/ Dielectric : FR - 4

Layer : 4 Layers

Surface treatment : OSP

Board thickness : 1.6 MM

Solder Mask : Blue

Min. Aperture : 0.3 MM

Line Width/Spacing : 0.1 / 0.1 MM

Size : 209 * 168 MM

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High TG170 PCB 1-20 Layers OEM Circuit Board PCB with Blue Solder Mask

We are the professional OEM High TG PCB manufacturer. The multilayer high TG printed circuit board is made with FR4 raw material with 1.6 mm board thickness. The specification of the PCB is 209*168 mm while the solder mask is blue.

High TG170 Impedance Control Pcb , Plain Pcb Board 4 Layers Anticorrosive

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc

Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)

Material Specification:High Tg / copper based / aluminum based or others (optional)

Board thickness: 0.1 - 6.0 mm

Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )

Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin

Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc

Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE
Board material	Fr - 4
Material brand	KB
Material Specification	Tg 170
Board thickness	1.6 mm
Copper thickness	1 Oz
Surface Treatment	ENIG
Solder mask / sSilk print	Green / White
Board size	100 mm * 100 mm
Quantity	10k

Technical Data

No.	Item	Data
1	Layer count	1-20 layers
2	Raw material type	Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper based, aluminum based
3	Raw material brand	Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc
4	Board thickness	0.1-6.0mm
5	Max board size	600 mm * 700 mm
6	Solder mask	Green, red, blue, black, white, yellow
7	Surface treatment	HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, and ENEPIG(electroless nickel - electroless palladium - immersion gold)
8	Copper thickness	0.05 Oz - 8 Oz (17 um-288 um )
9	Min Line width /space	0.065 mm / 0.065 mm
10	Finished hole size	0.10 - 5.95 mm
11	Blind/buried via	0.10 mm
12	Aspect ratio	10:1
13	PTH tolerance	+ / - 0.05 mm
14	Hole location tolerance	+ / - 0.05 mm
15	Impedance control tolerance	+ / - 8% mm
16	Outline tolerance	+ / - 0.10 mm

Lead Time

Layer count	Sample lead time/workday	Batch lead time/workday
1-2L	2	6
4L	5	8
6L	5	9
8L	6	10
10L	8	10
12L	8	12
14L	10	15
16L	10	18
18-40L (Up to difficulty)	at least 18	at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of quality Raw Materials will be used?

Board Brand	ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion	Rohm & Haas, Atotech, Umicore
Printing Ink	Taiyo, Rongda
Dry Film	Asahi, Dupont, Etertec

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Double Sided PCB
Double Sided PCBs also known as Double-Sided Plated Thru or DSPT, which are the gateway to higher technology applications compared to single sided PCB.
Double Sided PCB allow for the routing of traces around each other by jumping between a top and bottom layer by way of vias.
The ability to cross paths from top to bottom greatly increasing the circuit designer's flexibility in circuits designing and lends itself to greatly increased circuit densities.

Product Tags:

hdi circuit boards

high temperature pcb

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