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1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

Shenzhen Lefang Electronics Co., Ltd
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1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

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Brand Name : LEFANG

Model Number : OT6006L359

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1 Piece

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 290, 000sqm Per Month

Delivery Time : 2-10 work days

Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing

Base Material/ Dielectric : fr - 4

Layer : 6 Layers

Surface treatment : Immersion gold

Board thickness : 1.6mm

Solder Mask : Green

Min. Aperture : 0.15mm

Line Width/Spacing : 0.15 / 0.15 mm

Size : 45 * 12 mm

Copper Thickness : 140 µm / 4 oz

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1.6mm 6 Layers Fr4 ENIG 4 OZ Heavy Copper PCB Printed Circuit Board

 

 

The copper thickness of the PCB is 4 OZ / 140 µm, which enables the board to conduct a higher current than the tradition rigid printed circuit board. While the board thickness of thick copper board is 1.6 mm, with immersion gold surface treatment and green solder mask.

 

 

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

 

 

 

         How to get quick quotation?

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
 
        Technical Data
1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board
 
                              Item Details
                 Max layer count 20 L
                 Max board thickness 6.0 mm
                 Max aspect ratio 10 : 1
                 Max copper thickness 6 OZ
                 Max dimension 600 * 700mm
                 Min thickness of 4 layers PCB 0.4 mm
                 Min hole / pad 0.15 / 0.35mm
                 Hole location accuracy + / - 0.05mm
                 PTH hole tolerance + / - 0.05mm
                 Min line width and line space 0.065 / 0.065mm
                 Surface treatment

 

HASL / HASL lead free, OSP

 

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

 

silver plating, tin plating, platinum plating, carbon ink,

 

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

 

 

 

 

        Lead Time

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board
 
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

 


 

        What kinds of quality Raw Materials will be used?
1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

 

                     Board Brand ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
                     Potion Rohm & Haas, Atotech, Umicore
                     Printing Ink Taiyo, Rongda
                     Dry Film Asahi, Dupont, Etertec

 


 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - High Tg PCB
The glass transition temperature (Tg) is an important normative dimension for the base material that determines the temperature at which the resin matrix converts from a glassy, brittle condition into a soft, elastic one.
Normally high Tg refers to high heat resistance in PCB raw material.
The standard Tg for copper clad laminate is between 130 – 140℃. High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.
The higher of TG value, the better of pcb high temperature resistance.


Product Tags:

through hole pcb

      

copper pcb board

      
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