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Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

Shenzhen Lefang Electronics Co., Ltd
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Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

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Brand Name : LEFANG

Model Number : RM0004L053

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1 Piece

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal, MoneyGram

Supply Ability : 290, 000 sqm Per Month

Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing

Delivery Time : 2-10 work days

Raw material : Fr - 4

Layer count : 4 Layer

Board thickness : 1.6 mm

Copper thickness : 1 Oz / 35 µm

Surface treatment : HASL Lead Free

Solder mask : Green

Board size24.56 * 58.83 mm : 303 * 150 mm

Min. Aperture : 0.3 mm

Line Trace Width/Space : 0.13 / 0.13 mm

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Automated Pprocessing Printed Circuit Board High Frequency Motherboard PCB Board

 

 

The green solder mask 4 layers high frequency PCB Board is used in automated processing machine. While the surface treatment of the high frequency PCB is Lead Free HASL. Also, the board size of this PCB Circuit Board is 303 * 150 mm, and the minimum aperture is 0.3 mm.

 

 

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

 

 

 

        Why choose LEFANG?

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

 

 

-- Lefang provides One-Stop solution to save your cost and time.

 

        Quick Quotation - Competitive factory price is always offered
        Free Sample - Sample for free before mass production
        Quality Control - Sales Team monitors the production quality and lead time
        On Time Delivery - Customize the logistics plan according to customer’s requirement

        After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

 

 

        How to get quick quotation?

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
        Lead Time
Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm
 
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

 

 

        How to guarantee our high quality products?
Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

 

-- We employ 70 professional engineers to ensure our high quality products.

 

                       Department                Headcount
                       Electronic Eng.                     13
                       R&D Eng.                     15
                       PE Eng.                     10
                       CAM Eng.                     26
                       MI Eng.                      6

 


 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology. 

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size. 

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.


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